Micro-Optical MEMS, micro-mirros and pico-projectors
Aalto University is a new multidisciplinary science, business and arts community. It was founded in 2010, when Helsinki University of Technology, the Helsinki School of Economics and the University of Art and Design Helsinki were merged. Electronics Integration and Reliability (EILB) is part of the Department of Electrical Engineering and Automation located at the School of Electrical Engineering. The research at EILB focuses on materials and interconnects technologies for microelectronics and MEMS and their reliability, as well as on bioadaptive electronics. The group is internationally recognized in studies of interactions between dissimilar materials, interfacial reactions and impact of loads and stresses on heterogeneous miniaturized structures. To solve multimaterials compatibility issues EILB has developed a combined methodology approach based on thermodynamics of materials, reaction kinetics, and theory of microstructures as well as stress and strain analysis.
Main role in the project:
Reliability simulation of MOEMS Near-Infrared (NIR) microspectrometer. Investigate reliability of MOEMS FPI micro-spectrometer sensor packaging concepts in cooperation with Murata and VTT. Development of metal bonding process applicable to inertial and MOEMS devices together with Murata, VTT and Okmetic. Comprehensive reliability testing and failure analyses for the bonded test vehicles.
Professor Mervi Paulasto-Kröckel
Dr. Vesa Vuorinen
Dr. Jue Li
MSc Antti Rautiainen