Micro-Optical MEMS, micro-mirros and pico-projectors
Okmetic is a worldwide market leader in supplying a wide palette of silicon based starting materials for sensor manufacturers. In semiconductor wafers Okmetic’s speciality is very heavily doped wafers for power semiconductors as well as high resistivity wafers for RF-applications. Products include double side polished (DSP) wafers, wafers with epitaxial layers (both P/N and very heavily doped layers), SOI wafers, C-SOI (SOI wafers with buried cavities), G-SOI (SOI wafers with gettering layer enabling CMOS-sensor integration) and capping wafers. Main customer applications are automotive and industrial control sensors, but wafers are delivered increasingly to consumer applications, too. Sales for 2012 was about 83 M€ and amount of personnel is approximately 360. Okmetic is currently a partner in four running ENIAC projects: Esip, Epamo, Prominent and Lab4MEMS and in one finished program E3Car.
Main role in the project:
Develop high-quality silicon substrates for MOEMS pilot line. SOI and C-SOI wafers made by bonding and subsequent device layer thinning offer many benefits in MEMS and MOEMS manufacturing. The work is divided into two parallel paths. The layer transfer process is done in Okmetic line utilizing new technologies developed in Lab4MEMS II, and the ion beam thinning task is shared between Okmetic and VTT – starting wafers are prepared at Okmetic and ion beam thinning is subcontracted to VTT to their new system that is expected to be operational by the end of 2013. OKM is WP1 leader.
Dr. Jari Mäkinen